Protecting your privacy is important to us. We hope the following statement will help you understand how the Cryogenics Engineering Conference (CEC) and International Cryogenic Materials Conference (ICMC) collects and uses the personal information you provide to us on our websites.
CEC/ICMC takes great care when presenting information on its websites but cannot guarantee that published content is accurate, up-to-date, reliable, or complete. Consequently, CEC/ICMC cannot be held responsible for third-party content, even if the CEC/ICMC websites link or refer to them. CEC/ICMC reserves the right to modify or erase content published on its website without prior notice and at any time.
Google Analytics and User Data
Personal information such as your name, address, phone number, or e-mail address is not collected as you browse. However, on most of the website, CEC/ICMC uses Google Analytics to collect non-personal visitor data in order to generate metrics that will help improve its content and better organize information. CEC/ICMC uses the anonymized version of Google Analytics (link) which transmits only a subset of the visitor’s IP address to Google.
Like all analytics software, Google Analytics uses “cookies”, which are text files inserted in the user’s computer, in order to help websites analyze their traffic. By visiting and using the CEC/ICMC website, you agree to allow the CEC/ICMC webmasters, as well as Google, to collect your anonymous data.
If you are receiving emails from firstname.lastname@example.org, it is because you have been or are a current registrant or an exhibitor at a CEC/ICMC Conference, have been an author on an abstract submitted for an CEC/ICMC Conference, have expressed interest by adding your email address to the CEC/ICMC email list or your email address was provided to CEC/ICMC from a conference with a similar topic. You have the option to opt out from receiving any future CEC/ICMC emails by clicking the “unsubscribe” link found in any of the CEC/ICMC conference announcement/reminder emails.