New for 2021 CEC/ICMC – Late-Breaking Abstract Submissions: due date June 28

While the main program is almost finalized, because CEC-ICMC is virtual in 2021, we are planning to try to include late breaking sessions. This is new for CEC/ICMC’21, to allow anyone who is still interested to have the opportunity to present.

The abstract site has been opened for submissions until June 28. Late-breaking abstracts may arrive too late to be organized into theme-oriented sessions, however they will be organized into overall topics. If they arrive soon enough, they may be considered for theme-oriented sessions if possible.

–> Click here for Abstract Submission Details. <–


CEC-01 – Large-Scale Refrigeration and Liquefaction
CEC-02 – Large-Scale Systems, Facilities and Testing
CEC-03 – Cryocoolers (Non-Aerospace)
CEC-04 – Cryocoolers (Aerospace)
CEC-05 – Components: Expanders, Pumps, Compressors and Regenerators
CEC-06 – Components: Superconducting Magnet Systems
CEC-07 – Components: Superconducting RF Systems, Power Cables, and Leads
CEC-08 – Applications: Instrumentations, Visualization and Controls
CEC-09 – Applications: Fuel, Transportation, Medical, and Food
CEC-10 – Applications: Aerospace
CEC-11 – Applications: Safety, Reliability and Standards
CEC-12 – Applications: Medicine and Biology
CEC-13 – Thermal-Fluid Transport and Properties: Fluids Boiling Above 50 K
CEC-14 – Thermal-Fluid Transport and Properties: Fluids Boiling Below 50 K
CEC-15 – Thermal-Fluid Transport and Properties: Thermal Insulation Systems
CEC-16 – Miscellaneous


ICMC-01 – NbTi/Nb3Sn/A15
ICMC-02 – MgB2 Wires and Tapes
ICMC-03 – BSCCO Wires and Tapes
ICMC-04 – REBCO Coated Conductors
ICMC-05 – Flux Pinning and Critical Current
ICMC-06 – LTS and HTS Cables
ICMC-07 – HTS and MgB2 Bulks
ICMC-08 – Fe-based and New Superconducting Materials
ICMC-09 – Thin Films, Multilayers, and Artificial Structures
ICMC-10 – Cryogenic Materials Testing and Methods
ICMC-11 – Metallic, Ceramic, Composite and Polymeric Materials
ICMC-12 – Insulation/Conduction, Resins and Impregnation, and Dielectric Properties
ICMC-13 – Thermal, Electrical, and Magnetic Properties, Radiation, Degradation
ICMC-14 – Superconductor Measurements: Mechanical, Electrical, AC Loss and Stability
ICMC-15 – Applications: Microelectronics, Photonics, Sensors, Detectors, Computation
ICMC-16 – Applications: Power Electronics, Electric Propulsion, Transportation
ICMC-17 – Special Sessions

Suggestions concerning the technical program, particularly topical workshops and special sessions, should be directed to the appropriate Conference or Program Chair.

CEC Conference Chair CEC Program Chair CEC Program Vice-chair CEC Program Vice-chair
Peter Bradley
Boulder, CO
Sastry Pamidi
FAMU-FSU, College of Eng.
Tallahassee, FL
Peter Kittel
Palo Alto, CA
Chul Kim
Florida State University, CAPS
Tallahassee, FL
ICMC Conference Chair ICMC Program Co-Chair ICMC Program Co-Chair  
Timothy Haugan
Wright-Patterson AFB, OH
Shreyas Balachandran
Tallahassee, FL
Tengming Shen
Berkeley, CA


Click on the image below to open the Call for Abstracts in PDF format.

[Abstract Submission Deadline Extended to April 26, 2021]

Click on the image to open the Call for Abstracts in PDF format.