Thank you to our Conference Sponsors

 

Welcome to CEC/ICMC 2021!

As we have become all too accustomed, uncertainties arising from the pandemic persist regarding prospects to hold the CEC/ICMC’21 conference safely in the collegial setting we have always enjoyed. These uncertainties along with recommendations from the CEC and ICMC community led to the decision to cancel the in-person conference scheduled for September 12-16, 2021 in Honolulu, Hawai’i. We invite you to attend the now virtual 2021 joint 23rd Cryogenic Engineering Conference and International Cryogenic Materials Conference scheduled to take place from July 19 – 23, 2021.

Virtual technology continues to evolve, and we have been presented the opportunity to benefit from recent past conferences held in 2020. This allows for us to engage the CEC/ICMC community with a lively, enriching virtual meeting of cryogenic-related topics exchanging recent state-of-the-art developments in all areas of cryogenics, including superconductivity, cryocoolers, cryogenic materials, and applications.

We acknowledge and thank Scientific Instruments, Inc. and Sumitomo (SHI) Cryogenics for America, Inc. for sponsoring efforts to conduct a successful CEC/ICMC 2021. We look forward to a rich and engaging event in 2021 and look forward to meeting in person in Honolulu, Hawai’i in 2023!

We hope to see you at CEC/ICMC 2021 to pursue “Cryogenics Through Collaboration”.

Peter Bradley Timothy Haugan
CEC Conference Chair ICMC Conference Chair

 


ANNOUNCEMENTS
Abstract Submission Starts March 1, 2021
Exhibit Registration Starts March 22, 2021
Conference Registration Starts April 12, 2021
Abstract Submission Deadline April 15, 2021
Student Waiver Program – Extended Abstracts Due April 30, 2021
CEC Board Election Nomination Deadline May 17, 2021
Awards Nominations see Awards page for different deadlines
Tentative Schedule at a Glance (SaaG) Now Available  

Site last updated: April 12, 2021