Thank you to our Conference Sponsors

 

ANNOUNCEMENTS
Student Waiver Program – Extended Abstracts Due April 30, 2021
CEC Board Election Nomination Deadline Extended May 28, 2021
Awards Nominations see Awards page for different deadlines
Tentative Schedule at a Glance (SaaG) & List of Sessions Updated 6.4.21
Conference Registration Early Fee Deadline extended to June 8, 2021
Exhibit Registration Closes July 2, 2021
Paper Guidelines Now Available paper submission starts July 20, 2021

Welcome to CEC/ICMC 2021!

As we have become all too accustomed, uncertainties arising from the pandemic persist regarding prospects to hold the CEC/ICMC’21 conference safely in the collegial setting we have always enjoyed. These uncertainties along with recommendations from the CEC and ICMC community led to the decision to cancel the in-person conference scheduled for September 12-16, 2021 in Honolulu, Hawai’i. We invite you to attend the now virtual 2021 joint 23rd Cryogenic Engineering Conference and International Cryogenic Materials Conference scheduled to take place from July 19 – 23, 2021.

Virtual technology continues to evolve, and we have been presented the opportunity to benefit from recent past conferences held in 2020. This allows for us to engage the CEC/ICMC community with a lively, enriching virtual meeting of cryogenic-related topics exchanging recent state-of-the-art developments in all areas of cryogenics, including superconductivity, cryocoolers, cryogenic materials, and applications.

We acknowledge and thank Scientific Instruments, Inc. and Sumitomo (SHI) Cryogenics of America, Inc. for sponsoring efforts to conduct a successful CEC/ICMC 2021. We look forward to a rich and engaging event in 2021 and look forward to meeting in person in Honolulu, Hawai’i in 2023!

We hope to see you at CEC/ICMC 2021 to pursue “Cryogenics Through Collaboration”.

Peter Bradley Timothy Haugan
CEC Conference Chair ICMC Conference Chair

Site last updated: June 11, 2021